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FDP8030L/FDB8030L
November 1999
FDP8030L/FDB8030L
N-Channel Logic Level PowerTrench MOSFET
General Description
This N-Channel Logic level MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. These MOSFETS feature faster switching and lower gate charge than other MOSFETS with comparable RDS(on) specifications. The result is a MOSFET that is easy and safer to drive (even at very high frequencies), and DC/DC power supply designs with higher overall efficiency.
Features
* 80 A, 30 V. RDS(ON) = 0.0035 @ VGS = 10 V RDS(ON) = 0.0045 @ VGS = 4.5 V
* Critical DC electrical parameters specified at elevated temperature * Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor * High performance trench technology for extremely low RDS(ON) * 175C maximum junction temperature rating
D
D
G
G D S TO-220
FDP Series
G
S
TO-263AB
FDB Series
S
Absolute Maximum Ratings
Symbol
VDSS VGSS ID PD TJ, TSTG TL Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed
TA=25 C unless otherwise noted
o
Parameter
Ratings
30 20
(Note 1) (Note 1)
Units
V V A W WC C C
80 300 187 1.25 -65 to +175 275
Total Power Dissipation @# TC = 25C Derate above 25C Operating and Storage Junction Temperature Range Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds
Thermal Characteristics
RJC RJA Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient 0.8 62.5 C/W C/W
1999 Fairchild Semiconductor Corporation
FDP8030L Rev C(W)
Electrical Characteristics
Symbol
WDSS IAR
TA = 25C unless otherwise noted
Parameter
Single Pulse Drain-Source Avalanche Energy Maximum Drain-Source Avalanche Current Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage, Forward Gate-Body Leakage, Reverse
(Note 2)
Test Conditions
VDD = 20 V, ID = 80 A
Min
Typ
Max Units
1500 80 mJ A
Drain-Source Avalanche Ratings (Note 1)
Off Characteristics
BVDSS BVDSS TJ IDSS IGSSF IGSSR VGS = 0 V, ID = 250 A ID = 250 A, Referenced to 25C VDS = 24 V, VGS = 20 V, VGS = -20 V VGS = 0 V VDS = 0 V VDS = 0 V 30 23 10 100 -100 V mV/C A nA nA
On Characteristics
VGS(th) VGS(th) TJ RDS(on)
Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance
VDS = VGS, ID = 250 A ID = 250 A, Referenced to 25C VGS = 10 V, VGS = 4.5 V, ID = 80 A TJ=125C ID = 70 A VDS = 10 V ID = 80 A
1
1.5 -5 3.1 4.0 3.6
2
V mV/C
3.5 5.6 4.5
m
ID(on) gFS
VGS = 10 V, VDS = 10 V,
60 170
A S
Dynamic Characteristics
Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance
(Note 2)
VDS = 15 V, f = 1.0 MHz
V GS = 0 V,
10500 2700 1650
pF pF pF
Switching Characteristics
tD(on) tr tD (off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD = 15 V, VGS = 4.5 V, RGS = 10
ID = 50 A, RGEN = 10
20 185 160 200 120 27 48
35 225 200 240 170
ns ns ns ns nC nC nC
VDS = 15 V, ID = 80 A, VGS = 5 V
Drain-Source Diode Characteristics and Maximum Ratings
IS ISM VSD
Notes: 1. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%
Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VGS = 0 V,
(Note 1) (Note 1) (Note 1)
80 300 1 1.3
A A V
IS = 80 A
FDP8030L Rev C(W)
FDP8030L/FDB8030L
Typical Characteristics
100 I D , DRAIN-SOURCE CURRENT (A)
R DS(ON) , NORMALIZED
80
4.5V 3.5V
DRAIN-SOURCE ON-RESISTANCE
3
3.0V
2.5
VGS = 2.5V
60
2
40
1.5
3.0V 3.5V 4.5V 6.0V 10V
2.5V
20
1
0.5
0
0
20
0
0.5 1 1.5 V DS , DRAIN-SOURCE VOLTAGE (V)
2
40 60 80 I D, DRAIN CURRENT (A)
100
120
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.
0.01 ID = 40A RDS(ON), ON-RESISTANCE (OHM)
1.6 DRAIN-SOURCE ON-RESISTANCE
ID = 80A VGS = 10V
1.4
0.009 0.008 0.007 0.006 0.005 0.004 0.003 0.002 0.001 TA = 25oC TA = 125oC
R DS(ON), NORMALIZED
1.2
1
0.8
0.6 -50
-25
0 25 50 75 100 T J, JUNCTION TEMPERATURE (C)
125
150
0 2 3 4 5 6 7 8 VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. On-Resistance Variation with Temperature.
Figure 4. On-Resistance Variation with Gate-to-Source Voltage.
60
60 I S, REVERSE DRAIN CURRENT (A)
V DS = 10V
50 I D, DRAIN CURRENT (A) 40 30 20 10 0
10 1 0.1 0.01 0.001 0.0001
TA = 125C 25C -55C
T = -55C A 25C 125C
V GS = 0V
0 0.2 0.4 0.6 0.8 1 1.2 V SD , BODY DIODE FORWARD VOLTAGE (V) 1.4
1
2 3 V GS, GATE TO SOURCE VOLTAGE (V)
4
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.
FDP8030L Rev C(W)
FDP8030L/FDB8030L
Typical Characteristics
10 V GS , GATE-SOURCE VOLTAGE (V)
18000
ID = 80A
8
CAPACITANCE (pF)
V DS = 5V 10V 15V
10000
C iss
6
5000
C oss
2000
4
2
1000
VGS = 0V
C rss
0
0
40
80 120 160 Q g, GATE CHARGE (nC)
200
240
500 0.1
0.5 1 2 5 10 V DS, DRAIN TO SOURCE VOLTAGE (V)
30
Figure 7. Gate Charge Characteristics.
Figure 8. Capacitance Characteristics.
600 300 I D, DRAIN CURRENT (A)
R
(ON DS
5000
it Lim )
100 s
1ms 10 ms 100 ms DC
4000 POWER (W)
100 50 20 10 5 2 1 0.5 0.3
SINGLE PULSE R JC = 0.8C/W TC = 25C
3000
2000
VGS = 10V SINGLE PULSE RJC = 0.8 C/W TC = 25 C
1 3 5 10 20 V DS , DRAIN-SOURCE VOLTAGE (V) 30 50
1000
0 0.1
0.3
1
3 10 30 100 SINGLE PULSE TIME (mSEC)
300
1,000
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum Power Dissipation.
1 TRANSIENT THERMAL RESISTANCE 0.5 0.3 0.2 0.1 0.05 0.03 0.02
D = 0.5
r(t), NORMALIZED EFFECTIVE
0.2 0.1 0.05 0.02 0.01 Single Pulse P(pk)
RJC (t) = r(t) * RJC RJC = 0.8 C/W
t1
t2
T - TC = P * R JC (t) J Duty Cycle, D = t 1 /t 2
0.005 0.01
0.05
0.1
0.5
1
5 t1 ,TIME (ms)
10
50
100
500
1000
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c. Transient thermal response will change depending on the circuit board design.
FDP8030L Rev C(W)
TO-220 Tape and Reel Data and Package Dimensions
TO-220 Tube Packing Configuration: Figur e 1.0
Packaging Description:
TO-220 parts are ship ped normally in tube. The tube is made of PVC plastic treated with anti -stati c agent.These tubes in standard option are placed inside a dissipative plastic bag, barcode labeled, and placed inside a box made of recyclable corrugated pa per. One box contains two ba gs maximum (see fig. 1.0). And one or several o f these boxes are placed inside a labeled shipp ing bo x whic h c omes in different sizes dependi ng on the nu mber of parts ship ped. The other option comes in bulk as described in the Packagin g Information table. The unit s in this option are placed inside a small box laid w ith antistatic bubble sheet. These smaller boxes are individually labeled and placed ins ide a larger box (see fig. 3.0). These larger or intermediate boxes then will b e placed finally inside a labeled shipping box whic h still comes in different sizes depending on the number of units shipped.
45 unit s per Tube
12 Tubes per Bag
2 bag s per Box Conduct ive Plasti c B ag
530mm x 130mm x 83mm Intermediate box
TO-220 Packaging Information: Figure 2.0
TO-220 Packaging Information Packaging Option Packaging type Qty per Tube/Box Box Dimension (mm) Max qty per Box Weight per unit (gm) Note/Comments Standard
(no f l ow code )
FSCINT Labe l samp le
FAIRCHILD SEMICONDUCTOR CORPORATION
1080 uni ts maxi mum quant it y per bo x
S62Z BULK 300
LOT:
CBVK741B019
QTY:
HTB:B 1080
NSID:
FDP7060
SPEC:
Rail/Tube 45 530x130x83 1,080 1.4378
D/C1:
D9842
SPEC REV: QA REV:
B2
114x102x51 1,500 1.4378
FSCINT Label
(FSCINT)
TO-220 bulk Packing Configuration: Figure 3.0
FSCINT Label An ti-stati c Bubbl e Sheet s 530mm x 130mm x 83mm Intermediate box
1500 uni ts maxi mum quant it y per intermediate box 300 units per EO70 box 114mm x 102mm x 51mm EO70 Immed iate Box 5 EO70 boxe s per per Interm ediate Bo x
FSCINT Label
TO-220 Tube Configuration: Figure 4.0
Note: All dim ensions are in inches
0.123 +0.001 -0.003
0.165 0.080 0.450 .030 1.300 .015 0.032 .003 0.275
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
F9852 NDP4060L
0.160
20.000 +0.031 -0.065
0.800 0.275
August 1999, Rev. B
TO-220 Tape and Reel Data and Package Dimensions, continued
TO-220 (FS PKG Code 37)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 1.4378
September 1998, Rev. A
TO-263AB/D2PAK Tape and Reel Data and Package Dimensions
TO-263AB/D2PAK Packaging Configuration: Figure 1.0
Packaging Description:
EL ECT ROST AT IC SEN SIT IVE DEVICES
DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S
TNR D ATE PT NUMB ER PEEL STREN GTH MIN ___ __ ____ __ ___gms MAX ___ ___ ___ ___ _ gms
Antistatic Cover Tape
ESD Label
TO-263/D2PAK parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 800 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). This and some other options are further described in the Packaging Information table. These full reels are individually barcode labeled, dry packed, and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains one reel maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped.
CAUTION
Static Dissipative Embossed Carrier Tape Moisture Sensitive Label F63TNR Label Customized Label
TO-263AB/D2PAK Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel Note/Comments Standard (no flow code) TNR 800 13" Dia 359x359x57 800 1.4378 1.6050 L86Z Rail/Tube 45 530x130x83 1,080 1.4378 -
TO-263AB/D2PAK Unit Orientation
359mm x 359mm x 57mm Standard Intermediate box ESD Label
F63TNR Label sample
F63TNR Label
LOT: CBVK741B019 FSID: FDB6320L QTY: 800 SPEC:
DRYPACK Bag
(F63TNR)3
D/C1: D9842 D/C2:
QTY1: QTY2:
SPEC REV: CPN: N/F: F
TO-263AB/D2PAK Tape Leader and Trailer Configuration: Figure 2.0
Carrier Tape Cover Tape
Components Trailer Tape 400mm minimum or 25 empty pockets Leader Tape 1520mm minimum or 95 empty pockets
September 1999, Rev. B
F9835 FDB603AL
F9835 FDB603AL
F9835 FDB603AL
F9835 FDB603AL
Moisture Sensitive Label
TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued
TO-263AB/D2PAK Embossed Carrier Tape Configuration: Figure 3.0 P0
T E1
D0
F K0 Wc B0 E2 W
Tc A0 P1 D1
User Direction of Feed
Dimensions are in millimeter Pkg type TO263AB/ D2PAK (24mm)
A0
10.60 +/-0.10
B0
15.80 +/-0.10
W
24.0 +/-0.3
D0
1.55 +/-0.05
D1
1.60 +/-0.10
E1
1.75 +/-0.10
E2
22.25 min
F
11.50 +/-0.10
P1
16.0 +/-0.1
P0
4.0 +/-0.1
K0
4.90 +/-0.10
T
0.450 +/-0.150
Wc
21.0 +/-0.3
Tc
0.06 +/-0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C).
10 deg maximum Typical component cavity center line
0.9mm maximum
B0 10 deg maximum component rotation
0.9mm maximum
Sketch A (Side or Front Sectional View)
Component Rotation
A0 Sketch B (Top View)
Typical component center line
Sketch C (Top View)
Component lateral movement
TO-263AB/D Figure 4.0
2PAK
Reel Configuration:
Component Rotation
W1 Measured at Hub
Dim A Max
B Min Dim C
Dim A max
Dim N
Dim D min
DETAIL AA See detail AA W3
13" Diameter Option
W2 max Measured at Hub
Dimensions are in inches and millimeters
Tape Size
24mm
Reel Option
13" Dia
Dim A
13.00 330
Dim B
0.059 1.5
Dim C
512 +0.020/-0.008 13 +0.5/-0.2
Dim D
0.795 20.2
Dim N
4.00 100
Dim W1
0.961 +0.078/-0.000 24.4 +2/0
Dim W2
1.197 30.4
Dim W3 (LSL-USL)
0.941 - 0.1.079 23.9 - 27.4
August 1999, Rev. B
TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued
TO-263AB/D2PAK (FS PKG Code 45)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 1.4378
August 1998, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM
DISCLAIMER
ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8
SyncFETTM TinyLogicTM UHCTM VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. D

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